Residual Stresses Due To Refractory Inclusions In Silica Glass

Residual stresses due to thermal expansion mismatch of refractory particles in high purity silica glass were studied. Analytical models were used to calculate stresses for fully submerged isotropic particles. Materials studied include Zr02, Cr203, SiC and graphite particles in an Si02 matrix. Finite element analysis was used to calculate stresses for half submerged and anisotropic particles. The stress field results are discussed in a fracture mechanics framework, and the effect of residual stress on critical flaw size is presented.