A major force for change in substrate requirements in the late 90's may well be the commercialization of poly-silicon thin film transistor (TFT) Active Matrix Liquid Crystal Display (AMLCDs) technology. The processes necessary for "poly-Si" occur at temperatures that are 150-300 deg C higher than the current amorphous-Si LCD processes. This impacts the thermal shrinkage and thermal gravimetric warp requirements of the glass, particularly as display resolutions tighten, as enabled by poly-Si. In addition, the expected integration of more components (e.g. chip-on-glass) impacts the requirements for the thermal expansion of the substrate.
Origin
Corning Inc, Usa
Journal Title
Corning Research 1995 43-48
Sector
Special Glass
Class
S 1025