Low-Cost Flip-Chip Process For Monolithic Microwave Integrated Circuits And Optical Components

Flip-chip solder bonding is a method for simultaneously achieving attachment and interconnection between electronic components and substrates. It is particularly attractive for microwave and optical active devices. However, a major stumbling block to demonstrating flip-chip technology for any new of low-volume application is the requirement for whole semiconductor wafers in order to apply solder bumps to the die bond pads.