Finite Element Simulation Of Thermal Residue Stresses In Joining Ceramics With Thin Metal Interlayers

Finite element analysis was used to estimate thermal residual stresses developed in silicon nitride bodies bonded by metallic interlayers.

Author

S P Kovalev Et Al

Origin

Inst Ceramica Y Vidrio, Spain

Journal Title

J Am Ceram Soc 81 9 1998 2342-2348

Sector

Glass Ceramics

Class

GC 324

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Journal Title J Am Ceram Soc 81 9 1998 2342-2348

Class GC 324

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