Ceramics In Microelectronic Packaging

The use of ceramics and glasses in microelectronics for processing, storing, transferring, printing and displaying information is reviewed.

Author
R R Tummala
Origin
Ibm Research Div
Journal Title
Am Ceram Soc Bull 1988 67 4 752-758
Sector
Special Glass
Class
S 147

Request article (free for British Glass members)

Ceramics In Microelectronic Packaging
Am Ceram Soc Bull 1988 67 4 752-758
S 147
Are you a member?
This question is for testing whether or not you are a human visitor and to prevent automated spam submissions.
5 + 12 =
Solve this simple math problem and enter the result. E.g. for 1+3, enter 4.