Plasma Impulse Chemical Vapour Deposition (Picvd)

Chemical vapour deposition is a suitable technique for superior-quality high-rate coating with oxidic materials. Films produced by traditional deposition techniques are usually highly sensitive to environmental influences such as temperature and humidity of the air and consequently have unstable physical properties. The reason is found in the crystalline structure accompanied by high diffusivity along the grain boundaries or by porosity in sol-gel-made films.