Microstructurable glasses presenting very different thermal expansion coefficients and offering the possibility of joining them with various other materials are more and more important for microsensors and microactuators. This paper describes the development of a glass "family" with thermal expansion coefficients between 30...130. 10-7K-1, gives details about glass coils, filled with copper, and new glasses fit to be microstructured by Nd-YAG laser and anodically bonded at low temperatures.
Origin
Tech University Of Ilmenau, Germany
Journal Title
Proc Xvii Icg Vol 5 Beijing 1995 127-132
Sector
Special Glass
Class
S 2163