Due to rapid advances in consumer electronics, automotive electronics and mobile communication, the micro-electromechanical systems (MEMS) market is growing rapidly. Applications for MEMS cover diverse fields, including automotive, aeronautics, consumer, defence, industrial, medical and life science, and telecommunications. Various MEMS devices require a vacuum level or controlled atmosphere operation to ensure either good performance or an acceptable operation lifetime. Different wafer bonding technologies are commercially used for MEMS packaging. Among these, glass frit bonding offers multiple advantages, such as superior hermeticity, less stringent surface roughness requirements and tailored expansion matching to the materials being joined.
