The various applications of glasses and glass ceramics in electronic packaging are reviewed, including device passivation, thick- and thin film dielectric coatings, conductor and resistor pastes, die attach, bonding, thin-film substrates, and thick-film and cofired multilayered substrates.
Origin
Unknown
Journal Title
Ceramic Bulletin 1990 69 7 1131-1136
Sector
Special Glass
Class
S 419