Electronics Requirememts On The Material Parameters For High Frequency Microelectronics Packaging

The requirements that electronic circuit design may put on the materials parameters for high frequency microelectronics packaging are outlined. The materials discussed are glass ceramics.

Author
R D Seager, D S Campbell
Origin
Loughborough University Of Technology
Journal Title
Glass Technology 1990 31 3 131-134
Sector
Glass Ceramics
Class
GC 71

Request article (free for British Glass members)

Electronics Requirememts On The Material Parameters For High Frequency Microelectronics Packaging
Glass Technology 1990 31 3 131-134
GC 71
Are you a member?
This question is for testing whether or not you are a human visitor and to prevent automated spam submissions.
11 + 0 =
Solve this simple math problem and enter the result. E.g. for 1+3, enter 4.