In-plane stresses developed in a borosilicate glass (BSG) film during its constrained sintering on a rigid substrate was measured. Samples were prepared by casting BSG slurries on a silicon substrate and sintered inside a hot stage at 715 deg C just above the glass-softening temperature. In-plane stresses from the constrained-film sintering were determined by wafer-curvature measurements using an optical system.
Origin
Virginia Polytechnic Inst & State University, Usa
Journal Title
J Am Ceram Soc 78 3 1995 813-815
Sector
Special Glass
Class
S 853