Ceramic And Glass-Ceramic Packaging In The 1990S

A broad overview of packaging involving interconnecting, powering, protecting, and cooling semiconductor chips to meet a variety of computer system needs is presented.

Author
R R Tummala
Origin
Ibm Corporation
Journal Title
J Am Ceram Soc 1991 74 5 895-908
Sector
Glass Ceramics
Class
GC 94

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Ceramic And Glass-Ceramic Packaging In The 1990S
J Am Ceram Soc 1991 74 5 895-908
GC 94
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