Magnetron sputtering is the most used method for thin film deposition, supported by ease in scaling up to large dimensions, high deposition rate, good thickness control, layer quality, uniformity and the wide variety of materials to be deposited. Modular electronics, presented in this article by Bekaert, can provide optimal flexibility, thus maximising process stability and sputter rate. Further integration with the magnetron, magnetic system, target and gas distribution can improve overall control and flexibility.
Origin
Unknown
Journal Title
Glass Coatings 3/2006 18-21
Sector
Flat glass
Class
F 2198