Date
05 February 2018 - 07 February 2018
Location
Florida, USA
Organised by TCP, this conference will take place at Wyndham Grand Orlando hotel, Bonnet Creek, Orlando, Florida USA. The conference provides the latest information for those in the packaging supply chain. Attendees range from retailers and brand owners to resin suppliers, technology providers, equipment manufacturers and converters.
For the full details, please visit: www.thepackagingconference.com