The 11th annual packaging conference 2018

The 11th annual packaging conference 2018

Date 
5 February 2018 to 7 February 2018
Location 
Florida, USA

Organised by TCP, this conference will take place at Wyndham Grand Orlando hotel, Bonnet Creek, Orlando, Florida USA. The conference provides the latest information for those in the packaging supply chain. Attendees range from retailers and brand owners to resin suppliers, technology providers, equipment manufacturers and converters.

For the full details, please visit: www.thepackagingconference.com